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Thermaltake

Thermaltake TG-60 heat sink compound

Thermaltake TG-60 heat sink compound

SKU: 21282313
Gnáthphraghas €22,63
Gnáthphraghas Praghas díola €22,63
Díol Díolta amach
CBL san áireamh Ríomhtar an loingseoireacht ag an tseiceáil amach.

TG-60 Liquid Metal Compound is Thermaltake’s first liquid metal compound with high thermal conductivity of
52 W/m-k, and can be applied on copper or nickel-plated materials with excellent cooling performance.

High Thermal Conductivity
With a thermal conductivity of 52 W/m-k, the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds, ensuring the best cooling performance.

Even Better Cooling Performance
We’ve also tested TG-60 within our Thermal Chamber running Full Load for 30 minutes on each model under 25。 C ambient temperature and 50% humidity. Overclocking 4.8 GHz, we can see that compared to regular thermal compounds, TG-60 shows outstanding cooling performance and can perform even better than liquid metals from other brands.

All-In-One Application Kit
TG-60 Liquid Metal Compound has an application kit, which includes a set of tools for immediate use.
Features
Type: Thermal paste
Thermal conductivity: 52 W/m·K
Product colour: Black
Weight & dimensions
Weight: 1 g
Packaging data
Quantity per pack: 1 pc(s)

Thermaltake TG-60. Type: Thermal paste, Thermal conductivity: 52 W/m·K, Product colour: Black. Weight: 1 g. Quantity per pack: 1 pc(s)
Thermaltake




MBR CODE - CL-O034-GROSGM-A
EAN - 4713227531276
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